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How does.Net core JWT authentication work?

I’ve recently discovered.Net core and I’m kind of lost.
I’m using the standard MS samples to get myself started but I can’t really find how the token is validated. I get very confused with all the claims…
What are the main claims I need to be validating for a JWT?

issuer: my app server? or is it a web server running.Net core?
audience: my app server? or someone else?
exp/nact: when the token expires

How does the expiration work? I’m guessing since this is running on.Net core, it uses System.IdentityModel.Tokens.Jwt.JwtSecurityTokenHandler?
At some point in time, JwtSecurityTokenHandler.ValidateToken() will return a Task? Does this mean there is a separate Service running somewhere that validates the token on the server?

A:

It is the name claims only. The audience claims are determined by the issuer, so the app server claims itself as issuer, and whoever is validating the token as the audience.
There is a good read on this in the docs here.

ant and operated in conjunction with the [G]rand [C]lass [M]embership
Plan or as part of the [G]rand [C]lass [M]embership Plan.” Nothing indicates
that the Plan provides for permissive intervention.30
As noted, the district court made no ruling with respect to Preston.
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The present invention relates to a CMP (Chemical Mechanical Polishing) device, and more particularly to a CMP device including an improved slurry supplying system for supplying a slurry uniformly to a polishing pad mounted on a rotary turntable, which is rotated while being pressed to a surface of a wafer to be polished mounted on a chuck.
2. Description of the Related Art
In the process of fabricating semiconductor devices, a CMP (Chemical Mechanical Polishing) process is employed for planarizing a surface of a semiconductor wafer.
A CMP device in the art has a polishing pad fixedly mounted on a turntable, and a wafer mounted on a chuck is pressed against the polishing pad by a pressure arm having an edge portion slightly tilted from the center of the polishing pad. A slurry is supplied to the edge portion of the pressure arm or directly to the center of the polishing pad.
The slurry is partially supplied to the polishing pad because of inertia of a wafer having a small mass against rotation or lowering of the center of a wafer. There is also a problem that the slurry is consumed gradually in the course of using the polishing pad.
To solve the problem, there has been proposed an invention in which a stream of slurry is circulated in a direction along a surface of the polishing pad, while a cleaning pad is substituted to the pol
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